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| This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatever for the use of any t h ird pa rt y n o r u s ed f o r th e m an uf a c tu rin g p u rp o se s wit h o u t the express written consent Fuji Electric Co.,Ltd. DATE S P E C I F I C AT I O N Schottky Barrier Diode DWG.NO. CHECKED SEP.-05-`03 DRAWN SEP.-05-`03 SEP.-05-`03 NAME Device Name Spec. No. Type Name Model Name APPROVED SILICON DIODE MS5D1917 YA846C04B Fuji Electric Co.,Ltd. MS5D1917 Fuji Electric Co.,Ltd. Matsumoto Factory 1/12 H04-004-07 This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatever for the use of any t h ird pa rt y n o r u s ed f o r th e m an uf a c tu rin g p u rp o se s wit h o u t the express written consent Fuji Electric Co.,Ltd. SEP.-05 -2003 Date Classification Enactment Ind. DWG.NO. Fuji Electric Co.,Ltd. Content Issued date Applied date Drawn Checked Approved Revised Records MS5D1917 2/12 H04-004-06 1. SCOPE This specification provides the ratings and the test requirement for FUJI SILICON DIODE YA846C04B 2. OUT VIEW, MARKING, MOLDING RESIN, CHARACTERISTICS (1)Out view is shown (2)Marking is shown (3)Molding resin Epoxy resin UL : V-0 (4)Characteristics is shown MS5D1917 10/1212/12 3. RATINGS 3.1 MAXIMUM RATINGS (at Tc=25 unless otherwise specified.) ITEM SYMBOL CONDITIONS RATINGS Repetitive peak surge reverse voltage VRSM tw=500ns,duty=1/40 45 Repetitive peak reverse voltage VRRM 45 Square wave duty =1/2 Average output current Io 30* Tc= 98 Non-repetitive surge current ** IFSM Sine wave, 10ms 1shot 200 Operating junction temperature Tj 150 Storage temperature Tstg -40+150 * Out put current of center tap full wave connection. ** MS5D1917 MS5D1917 9/12 9/12 It is marked to type name or abbreviated type name, polarity and Lot No. UNITS V V A A This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatever for the use of any t h ird pa rt y n o r u s ed f o r th e m an uf a c tu rin g p u rp o se s wit h o u t the express written consent Fuji Electric Co.,Ltd. Rating per element UNITS V mA /W 3.2 ELECTRICAL CHARACTERISTICS (at Tc=25 unless otherwise specified.) ITEM SYMBOL CONDITIONS MAXIMUM *** Forward voltage VF IF= 12.5A 0.55 Reverse current *** IR VR=VRRM 1.0 Thermal resistance Rth(j-c) Junction to case 2.0 *** Rating per element 3.3 MECHANICAL CHARACTERISTICS Mounting torque Approximate mass Recommended torque 0.30.5 2.0 Nm g Fuji Electric Co.,Ltd. DWG.NO. MS5D1917 3/12 H04-004-03 4. TEST AND INSPECTION 4.1 STANDARD TEST CONDITION Standard test condition is Ta=25RH=65%. If judgment is no doubt, the test condition is possible to test in normal condition Ta=535RH=4885% 4.2 STRUCTURE INSPECTION It inspect with eye and measure,Item2 shall be satisfied. 4.3 FORWARD AND REVERSE CHARACTERISTICS It inspect on the standard condition,Item3.2 shall be satisfied. 4.4 TEST Test No. Test Items Testing methods and Conditions Pull force : 10N Force maintaining duration :101s Load force : 5N Number of times : 2times(90deg./time) Screwing torque value:(M3) : 4010Ncm Reference Standard EIAJ ED4701 A-111A method 1 A-111A method 3 A-112 method 2 Sampling number Acceptance number This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatever for the use of any t h ird pa rt y n o r u s ed f o r th e m an uf a c tu rin g p u rp o se s wit h o u t the express written consent Fuji Electric Co.,Ltd. 1 Terminal Strength (Tensile) 2 Terminal Strength (Bending) 3 Mounting Strength 4 Vibration Mechanical test 5 5 5 5 Shock 6 Solder ability 7 Resistance to Soldering Heat Frequency : 100Hz to 2kHz Acceleration : 100m/s2 A-121 Sweeping time : 4min./1 cycle 4times for each X, Y&Z directions. Peak amplitude : 15km/s2 A-122 Duration time : 0.5ms test code D 3times for each X, Y&Z directions. Solder temp. : 2355 Immersion time : 50.5s A-131A Each terminal shall be immersed in the test code A solder bath within 1to3.0mm from the body. Solder temp. : 2605C A-132 Immersion time : 101s Number of times : 1times 5 (0 : 1) 5 5 5 Fuji Electric Co.,Ltd. DWG.NO. MS5D1917 4/12 H04-004-03 Test No. Test Items Testing methods and Conditions Temperature :stg max Test duration : 1000h Temperature :stg min Test duration : 1000h Temperature : 852C Relative humidity : 855% Test duration : 1000h Temperature : 852C Relative humidity : 855% Bias Voltage : VRRMx 0.8 Test duration : 1000h Temperature : 1302C Relative humidity : 855% Vapor pressure : 230kPa Test duration : 48h High temp. side : Tstg max Room temp. : 535 Low temp. side : Tstg min Duration time : HT 30min,RT 5min LT 30min Number of cycles : 100 cycles Fluid : pure water(running water) High temp. side : 100+0/-5C Low temp. side : 0+5/-0C Duration time : HT 5min,LT 5min Number of cycles : 100 cycles Ta=255C Rated load Test duration : 1000h Tj=Tjmax 50 3min ON, 3min OFF Test duration : 10000cy Temperature : Ta=100 C Bias Voltage : VR=VRRM duty=1/2 Test duration : 1000h Reference Standard EIAJ ED4701 B-111A B-112A B-121A test code C B-122A test code C Samplin g number 22 22 22 Acceptance number 1 High Temp. Storage 2 Low Temp. Storage 3 Temperature Humidity Storage 4 Temperature Humidity Bias 5 Unsaturated Pressurized Vapor Endurance test 6 Temperature Cycle 22 B-123A test code B 22 This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatever for the use of any t h ird pa rt y n o r u s ed f o r th e m an uf a c tu rin g p u rp o se s wit h o u t the express written consent Fuji Electric Co.,Ltd. B-131A 22 (0 : 1) 7 Thermal Shock B-141A test code A 22 8 Steady state Operating life 9 Intermittent Operating life 10 High Temp. Reverse Bias D-402 22 D-403 22 D-404 22 Failure Criteria IR USL x 2 VFUSL x 1.1 USL : Upper specification Limit Fuji Electric Co.,Ltd. DWG.NO. MS5D1917 5/12 H04-004-03 5.Cautions Although Fuji Electric is continually improving product quality and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take adequate safety measures to prevent the equipment from causing physical injury, fire, or other problem in case any of the products fail. It is recommended to make your design fail-safe, flame retardant, and free of malfunction. The products described in this specification are intended for use in the following electronic and electrical equipment which has normal reliability requirements. Computers OA equipment Measurement equipment Electrical home appliances Communications equipment (Terminal devices) Machine tools Personal equipment AV equipment Industrial robots etc. The products described in this Specification are not designed or manufactured to be used in equipment or systems used under life-threatening situations. If you are considering using these products in the equipment listed below, first check the system construction and required reliability, and take adequate safety measures such as a backup system to prevent the equipment from malfunctioning. Transportation equipment (automobiles, trains, ships, etc.) Backbone network equipment This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatever for the use of any t h ird pa rt y n o r u s ed f o r th e m an uf a c tu rin g p u rp o se s wit h o u t the express written consent Fuji Electric Co.,Ltd. Traffic-signal control equipment Submarine repeater equipment Medical equipment Gas alarms, leakage gas auto breakers Burglar alarms, fire alarms, emergency equipment Nuclear control equipment etc. Do not use the products in this Specification for equipment requiring strict reliability such as (but not limited to): Aerospace equipment Aeronautical equipment 6.Warnings The Diodes should be used in products within their absolute maximum rating (voltage, current, temperature, etc. ). The diodes may be destroyed if used beyond the rating. The equipment containing Diodes should have adequate fuses or circuit breakers to prevent the equipment from causing secondary destruction (ex. fire, explosion etc...). Use the Diodes within their reliability and lifetime under certain environments or conditions. The Diodes may fail before the target lifetime of your products if used under certain reliability conditions. You must design the Diodes to be operated within the specified maximum ratings (voltage, current, temperature, etc. ) to prevent possible failure or destruction of devices. Consider the possible temperature rise not only for the junction and case, but also for the outer leads. Do not directly touch the leads or package of the Diodes while power is supplied or during operation, to avoid electric shock and burns. The Diodes are made of incombustible material. However, if a diode fails, it may emit smoke of flame. Also, operating the Diodes near any flammable place or material may cause the diodes to emit smoke or flame in case the Diodes become even hotter during operation. Design the arrangement to prevent the spread of fire. The Diodes should not used in an environment in the presence of acid, organic matter, or corrosive gas. (hydrogen sulfide, sulfurous acid gas.) The Diodes should not used in an irradiated field since they are not radiation proof. Fuji Electric Co.,Ltd. DWG.NO. MS5D1917 6/12 H04-004-03 Installation Soldering involves temperatures which exceed the device storage temperature rating. To avoid device damage and to ensure reliability, observe the following guidelines from the quality assurance standard. Table 1: Solder temperature and duration Solder Method Duration temperature Flow 2605 101second Soldering iron 35010 3.00.5second The immersion depth of the lead should basically be up to the lead stopper and the distance should be a maximum of 1.5mm from the device. When flow-soldering, be careful to avoid immersing the package in the solder bath. Refer to the following torque reference When mounting the device on a heat sink. Excess torque applied to the mounting screw causes damage to the device and weak torque will increase the thermal resistance, both of which conditions may destroy the device. Table 2:Recommended tightening torque Package style Screw Recommended tightening torque TO-220 M3 0.30.5Nm The heat sink should have a flatness within 30 and roughness within 10 Also, keep the m m. tightening torque within the limits of this specification. Improper handling may cause isolation breakdown leading to a critical accident. We recommend the use of thermal compound to optimize the efficiency of heat radiation. It is important to evenly apply the compound and to eliminate any air voids. Storage The Diodes must be stored at a standard temperature of 5 to 35 and relative humidity of 45 to 75%.If the storage area is very dry, a humidifier may be required. In such a case, use only deionized water or boiled water, since the chlorine in tap water may corrode the leads. The Diodes should not be subjected to rapid changes in temperature to avoid condensation on the surface of the Diodes. Therefore, store the Diodes in a place where the temperature is steady. The Diodes should not be stored on top of each other, since this may cause excessive external force on the case. The Diodes should not be stored with the lead terminals remaining unprocessed. Rust may cause presoldered connections to go fail during later processing. The Diodes should be stored in antistatic containers or shipping bags. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatever for the use of any t h ird pa rt y n o r u s ed f o r th e m an uf a c tu rin g p u rp o se s wit h o u t the express written consent Fuji Electric Co.,Ltd. Fuji Electric Co.,Ltd. DWG.NO. MS5D1917 7/12 H04-004-03 7.Appendix This products does not contain PBBs (Polybrominated Biphenyl) or PBDEs (Polybrominated Diphenyl Ether ) , substances. This products does not contain Class-I ODS and Class-II ODS substances set force by `Clean Air Act of US' law. If you have any questions about any part of this Specification, please contact Fuji Electric or its sales agent before using the product Neither Fuji nor its agents shall be held liable for any injury caused by using the products not in accordance with the instructions. The application examples described in this specification are merely typical uses of Fuji Electric products. This specification does not confer any industrial property rights or other rights, nor constitute a license for such rights. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatever for the use of any t h ird pa rt y n o r u s ed f o r th e m an uf a c tu rin g p u rp o se s wit h o u t the express written consent Fuji Electric Co.,Ltd. Fuji Electric Co.,Ltd. DWG.NO. MS5D1917 8/12 H04-004-03 This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatever for the use of any t h ird pa rt y n o r u s ed f o r th e m an uf a c tu rin g p u rp o se s wit h o u t the express written consent Fuji Electric Co.,Ltd. DWG.NO. Fuji Electric Co.,Ltd. MS5D1917 9/12 H04-004-03 Forward Characteristic 100 (typ.) Reverse Characteristic (typ.) Tj=150 Tj=125 102 Tj=100 101 Forward Current Tj=150 Tj=125 Tj=100 Tj=25 Reverse Current 10 100 Tj= 25 10-1 This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatever for the use of any t h ird pa rt y n o r u s ed f o r th e m an uf a c tu rin g p u rp o se s wit h o u t the express written consent Fuji Electric Co.,Ltd. R 10-2 10-3 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 0 10 20 30 40 50 1 0.1 0.0 Forward Voltage R Reverse Voltage Forward Power Dissipation (max.) 22 40 38 20 36 34 18 32 Reverse Power Dissipation (max.) DC Reverse Power Dissipation Square wave =60 Square wave =120 Sine wave =180 Square wave =180 30 28 26 24 22 20 18 16 14 12 10 8 6 =180 16 Forward Power Dissipation 14 12 10 8 DC 6 4 2 Per 1element 0 0 2 4 6 8 10 12 14 16 4 2 0 0 5 10 15 20 25 30 35 40 45 50 Average Forward Current Reverse Voltage Fuji Electric Co.,Ltd. DWG.NO. MS5D1917 10/12 H04-004-03 Current Derating 160 (Io-Tc) (max.) 10000 Junction Capacitance Characteristic (typ.) 150 140 130 120 DC 110 Case Temperature Junction Capacitance j 1000 100 35 40 45 100 Sine wave =180 Square wave =180 90 Square wave =120 80 This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatever for the use of any t h ird pa rt y n o r u s ed f o r th e m an uf a c tu rin g p u rp o se s wit h o u t the express written consent Fuji Electric Co.,Ltd. 70 60 Square wave =60 50 0 5 10 15 20 25 30 10 100 Average Output Current Reverse Voltage :Conduction angle of forward current for each rectifier element Io:Output current of center-tap full wave connection Surge Capability (max.) 1000 Peak Half - Wave Current FSM 100 10 1 10 100 Number of Cycles at 50Hz Fuji Electric Co.,Ltd. DWG.NO. MS5D1917 11/12 H04-004-03 This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatever for the use of any t h ird pa rt y n o r u s ed f o r th e m an uf a c tu rin g p u rp o se s wit h o u t the express written consent Fuji Electric Co.,Ltd. Transient Thermal Impedance 10 10 0 -2 -1 (C/W) 10 10 1 10 -3 10 -2 DWG.NO. Fuji Electric Co.,Ltd. 10 -1 Transient Thermal Impedance (max.) t Time (sec) 10 0 Rth j-c:2.0/W 10 1 MS5D1917 10 2 12/12 H04-004-03 |
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